SEMI International Standards
Standards Locale: North America
Committee: 3DS-IC
Place of Meeting: SEMI Headquarters in San Jose, California
Date of Meeting: 04/02/2013
Meeting End Date: 04/02/2013
Recording SEMI Standards Staff: Paul Trio
CER Posted to Web: 04/11/2013
Leadership Changes
None.
TC Chapter Structure Changes
None.
Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
5173C | New Standard: Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack | Failed and will be reballoted |  |
5175 | New Standard: Guide for Multi-Wafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames | Passed as balloted. |  |
5409 | New Standard: Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks | Passed as balloted. |  |
5410 | New Standard: Guide for Metrology Techniques to be used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures | Passed with editorial changes. |  |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
5588 | SNARF | Bonded Wafer Stack TF | Line Item Revision to SEMI 3D2-0113, Specification for Glass Carrier Wafers for 3DS-IC Applications |
Note: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF
Authorized Ballots
# | When | SC/TF/WG | Details |
5173D | Cycle 3, 2013
(or C4-13) | Bonded Wafer Stacks TF | New Standard: Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack |
5588 | Cycle 3, 2013 | Bonded Wafer Stack TF | Line Item Revision to SEMI 3D2-0113, Specification for Glass Carrier Wafers for 3DS-IC Applications |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
SEMI 3DS-IC Google Site
This site contains information on 3DS-IC task forces, recent meeting information, upcoming meeting schedule, and other pertinent information:
https://sites.google.com/a/semi.org/3dsic/
Next Meeting
North America Standards Meetings at SEMICON West 2013
July 8-11, 2013
San Francisco Marriott Marquis Hotel
55 Fourth Street
San Francisco, California 94103
U.S.A.
Tuesday, July 9
- Inspection & Metrology TF (8:00 AM to 10:00 AM)
- Bonded Wafer Stacks TF (10:00 AM to 12:00 Noon)
- Thin Wafer Handling TF (1:00 PM to 3:00 PM)
- NA 3DS-IC Committee (3:00 PM to 5:00 PM)
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