SEMI International Standards
Standards Locale: North America
Committee: 3DS-IC
Place of Meeting: SEMI Headquarters in San Jose, California
Date of Meeting: 10/25/2011
Meeting End Date: 10/25/2011
Recording SEMI Standards Staff: Paul Trio
CER Posted to Web: 11/03/2011
Leadership Changes
None.
TC Chapter Structure Changes
None.
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
None.
Authorized Ballots
# | When | SC/TF/WG | Details |
5173 | Cycle 1, 2012 | Bonded Wafer Stacks TF | New Standard: Specification for Parameters for Bonded Wafer Stacks |
5175 | Cycle 1, 2012
(or C2-12) | Thin Wafer Handling TF | New Standard: Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers |
5269 | Cycle 1, 2012 | Inspection & Metrology TF | New Standard: Guide for Terminology for Measured Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
North America Standards Spring 2012 Meetings
April 2-5, 2011
SEMI Headquarters
3081 Zanker Road
San Jose, California
U.S.A.
Tuesday, April 3
- Inspection & Metrology TF (8:00 AM to 10:00 AM)
- Bonded Wafer Stacks TF (10:00 AM to 12:00 Noon)
- Thin Wafer Handling TF (1:00 PM to 3:00 PM)
- NA 3DS-IC Committee (3:00 PM to 5:00 PM)
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