CER - Japan Silicon Wafer Committee Meeting held on 12/08/2011

SEMI International Standards
Standards Locale: Japan
Committee: Silicon Wafer
Place of Meeting: Makuhari Messe, Chiba, Japan
Date of Meeting: 12/08/2011
Meeting End Date: 12/08/2011
Recording SEMI Standards Staff: Akiko Yamamoto
CER Posted to Web: 12/27/2011
Leadership Changes
None.

TC Chapter Structure Changes
None.

Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.

Document #	Document Title	Committee Action	A&R Forms for Approved Ballots
5034	Revision of SEMI M71-0310, Specification for Silicon-on-Insulator (SOI) Wafers for CMOS LSI	Failed
4766A	Revision to SEMI M52-0307 with title change to: Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 11 nm Technology Generations	Passed as balloted
4846B	New Standard: Test Method for Analyzing Organic Contaminants on Silicon Wafer Surfaces	Failed
5253A	Revision of SEMI M49-0311, Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology Generation	Passed with editorial changes
5321	Revision to SEMI M24-0307, Specification for Polished Monocrystalline Silicon Premium Wafers
Line Item 1	Update of Referenced Standards and Documents	Passed with editorial changes
5322	Revision to SEMI M61-0307, Specification for Silicon Epitaxial Wafers with Buried Layers
Line Item 1	Update of Referenced Standards and Documents	Passed as balloted
Line Item 2	Numbering Correction in Table 1	Passed as balloted
Line Item 3	Update in �10 “Product Labeling”	Passed as balloted

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#	Type	SC/TF/WG	Details
TBD	SNARF	Int'l 450mm Shipping Box Task Force	Revisions to SEMI M80-1111, Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers

Note: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF

Authorized Ballots

#	When	SC/TF/WG	Details
5251	C1-12	Int'l Polished Wafers Task Force	Revision of SEMI M1, Specifications for Polished Single Crystal Silicon Wafers (Re:Addition of node-specific guides)
5342	C1-12	Int'l Epitaxial Wafers Task Force	Revision to M62-1011 Specifications for Silicon Epitaxial Wafers (Addition of 450 mm wafer to Table R2-8 Epi wafer guide for 22nm technology Generation)
5034A	C1-12	Int'l SOI Wafers Task Force	Revision of SEMI M71-0310, Specification for Silicon-on-Insulator (SOI) Wafers for CMOS LSI
5029B	C1-12	Test Method Task Force	Revision to SEMI M51-0303, with title change from: Test Method for Characterizing Silicon Wafers by Gate Oxide Integrity to: Test Method for Time Zero Dielectric Breakdown Characteristics of SiO2 Films for Silicon Wafer Evaluation

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
SEMI Japan Standards Spring 2012 Meetings
Tuesday, March 6, 2012 13:00-17:00
SEMI Japan, Tokyo, Japan

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