CER - Japan Assembly & Packaging Committee Meeting held on 11/25/2011

SEMI International Standards
Standards Locale: Japan
Committee: Assembly & Packaging
Place of Meeting: SEMI Japan Office, Tokyo
Date of Meeting: 11/25/2011
Meeting End Date: 11/25/2011
Recording SEMI Standards Staff: Hirofumi Kanno
CER Posted to Web: 12/08/2011
Leadership Changes

Group	Previous Leader	New Leader
Japan Packaigng Committee	Haruo Tabata / Osaka University	#1
Japan Assembly & Test Die Preparation TF	Kinya Mochida / Lintec	Kenichi Watanabe / Lintec

#1 Masahiro Tsuriya will be appinted as co-leader of the Japan Packaging Committee after JRSC's approval.

Pd-PPF Wettability Measurement TF was disbanned.

TC Chapter Structure Changes
None.

Ballot Results

Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.

Document #	Document Title	Committee Action	A&R Forms for Approved Ballots
4965A	New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process	Passed with editorial changes
4814A	New Standard: Specification for Tape Frame Cassette for 450 mm Wafer	Passed with editorial changes
5294	New Standard: Measurement Method for Solder Sphere Size for Ball Grid Array Package	Passed with editorial changes

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
None.

Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
The next Japan Packaging Committee is scheduled in February or March, 2012.
The detailed meeting schedule will be finalized at the next Japan Packaging Committee co-chairs Meeting.

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