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SEMI International Standards
Standards Locale: Europe
Committee: Silicon Wafer
Place of Meeting: Messe Dresden, Dresden, Germany
Date of Meeting: 10/13/2011
Meeting End Date: 10/13/2011
Recording SEMI Standards Staff: Kevin Nguyen
CER Posted to Web: 10/23/2011
Leadership Changes

Group
Previous Leader
New Leader
Int'l AWG TFFrank Riedel (Siltronic), new co-leader in Europe
.

TC Chapter Structure Changes
None.

Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.
Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
4766Revision to SEMI M52-0307 with title change to: Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers from 130 nm Down to 11 nm Technology GenerationsFailed
5253Revision of SEMI M49-0311, Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology GenerationsFailed


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
None.

Authorized Ballots

#
When
SC/TF/WG
Details
4766ACycle 7-2011Int'l ASI TFRevision to SEMI M52-0307 with title change to: Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers from 130 nm Down to 11 nm Technology Generations
5253ACycle 7-2011Int'l AWG TFRevision of SEMI M49-0311, Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology Generations
.

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
The next meeting is confirmed at SEMICON Europa in October 2012 in Dresden, Germany. Check www.semi.org/standards for the exact meeting schedule.









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