SEMI International Standards
Standards Locale: North America
Committee: Physical Interfaces & Carriers
Place of Meeting: Adam’s Mark Hotel in Dallas, Texas
Date of Meeting: 04/09/2008
Meeting End Date: 04/09/2008
Recording SEMI Standards Staff: Paul Trio
CER Posted to Web:
Leadership Changes
Task Force Changes
* The EUV Mask Carrier and Load Port Standards Task Force updated its TFOF and changed its name to the EUV Reticle Handling Task Force
Leadership Changes
* Phil Seidel (Sematech) has resigned as leader of the EUV Reticle Handling Task Force
* The following have been identified as co-leaders of the EUV Reticle Handling Task Force:
- Long He (Sematech)
- David Halbmaier (Entegris)
- Yoshio Gomei (Canon)
- John Zimmerman (ASML)
NA PI&C Leadership:
Co-chair: Mutaz Haddadin (Intel)
Co-chair: Stephen Sumner (Entegris)
Technical Editor: Larry Hartsough (UA Associates)
TC Chapter Structure Changes
None.
Ballot Results
| * Voting Period – Cycle 1 * |
| Document # | Document Title | Committee Approval Status |
4551 | Reapproval for SEMI E19.3, Port Standard for Mechanical Interface of Wafer Cassette Transfer, 150 mm (6 inch) Port | Failed – rework |
4552 | Reapproval for SEMI E19.2, Port Standard for Mechanical Interface of Wafer Cassette Transfer, 125 mm (5 inch) Port | Failed – rework |
4553 | Reapproval for SEMI E19.1, Port Standard for Mechanical Interface of Wafer Cassette Transfer, 100 mm (4 inch) Port | Failed – rework |
| * Voting Period – Cycle 2 * |
| Document # | Document Title | Committee Approval Status |
4371-LI | Revision to SEMI E85, Specification for Physical AMHS Stocker to Interbay Transport System Interoperability
Line Item 1 – Decrease A1 from 375mm to 250mm | Failed – rework |
4371-L2 | Line Item 2 – Decrease H2 from 130mm to 100mm | Failed – rework |
4371-L3 | Line Item 3 – Add option A’ with a decreased value for C3 of 53mm | Failed – rework |
4371-L4 | Line Item 4 – Increase D1 from 150mm to 220mm | Failed – rework |
4466 | New Standard: Mechanical Specification for a 150 mm EUVL Reticle SMIF Pod (Euv Pod) | Failed – rework |
4548 | Reapprovals for SEMI E22, Cluster Tool Module Interface: Transport Module End Effector Exclusion Volume Standard and and SEMI E22.1, Cluster Tool Module Interface 300 mm: Transport Module End Effector Exclusion Volume Standard | Failed – rework |
4549 | Reapprovals for SEMI E21, Cluster Tool Module Interface: Mechanical Interface and Wafer Transport Standard and SEMI E21.1, Cluster Tool Module Interface 300 mm: Mechanical Interface and Wafer Transport Standard | Failed – rework |
4550 | Withdrawal for SEMI E20, Cluster Tool Module Interface: Electrical Power and Emergency Off Standard | Failed – rework |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
* * * New SNARFs * * * |
| Document # | Document Title | Task Force |
TBA | New Standard: 450mm Load Port and Interface Standard | 450 mm IPIC |
TBA | Revision to SEMI E84, Specification for Enhanced Carrier Handoff Parallel I/O Interface
SNARF approved by NA PIC but will be submitted to the Global Coordinating Subcommittee (GCS) for subsequent approval | E84 Revision |
| TBA – to be assigned |
* * * Revised SNARFs * * * |
| Document # | Document Title | Task Force |
4570 | New Standard: 450mm In-Fab Carrier and Interface Standard | 450 mm IPIC |
* * * Revised TFOFs * * * |
| Task Force | Details |
| EUV Reticle Handling Task Force | Formerly EUV Mask Carrier and Load Port Standards Task Force. Updated charter, scope, and membership list |
| 450mm IPIC Task Force | Added development of carrier handoff (i.e., E84) requirements to task force scope + membership updates |
* * * To be submitted for Global Coordinating Subcommittee (GCS) Approval * * * |
| Document # | Document Title | Task Force |
TBA | Revision to SEMI E84, Specification for Enhanced Carrier Handoff Parallel I/O Interface
SNARF approved by NA PIC but will be submitted to the Global Coordinating Subcommittee (GCS) for subsequent approval | E84 Revision |
TBA | SEMI E1 rewrite (i.e., consolidation of SEMI E1 and its subdocuments into one standard). Revisions to:
* SEMI E1, Specification for 3 inch, 100 mm, 125 mm, and 150 mm Plastic and Metal Wafer Carriers
* SEMI E1.1, Standard for 3 inch Plastic and Metal Wafer Carriers, General Usage
* SEMI E1.2, Standard for 100 mm Plastic and Metal Wafer Carriers, General Usage
* SEMI E1.3, Standard for 125 mm Plastic and Metal Wafer Carriers, General Usage
* SEMI E1.4, Standard for 125 mm Plastic and Metal Wafer Carriers, Auto Transport Usage
* SEMI E1.5, Standard for 150 mm Plastic and Metal Wafer Carriers, General Usage
| Global PIC Maintenance |
TBA | Revision to SEMI E19.1, Port Standard for Mechanical Interface of Wafer Cassette Transfer, 100 mm (4 inch) Port | Global PIC Maintenance |
TBA | Revision to SEMI E19.2, Port Standard for Mechanical Interface of Wafer Cassette Transfer, 125 mm (5 inch) Port | Global PIC Maintenance |
TBA | Revision to SEMI E19.3, Port Standard for Mechanical Interface of Wafer Cassette Transfer, 150 mm (6 inch) Port | Global PIC Maintenance |
TBA | Revisions to SEMI E21, Cluster Tool Module Interface: Mechanical Interface and Wafer Transport Standard and SEMI E21.1, Cluster Tool Module Interface 300 mm: Mechanical Interface and Wafer Transport Standard | Global PIC Maintenance |
TBA | Revisions to SEMI E22, Cluster Tool Module Interface: Transport Module End Effector Exclusion Volume Standard and and SEMI E22.1, Cluster Tool Module Interface 300 mm: Transport Module End Effector Exclusion Volume Standard | Global PIC Maintenance |
TBA | Reapproval for SEMI E20, Cluster Tool Module Interface: Electrical Power and Emergency Off Standard | PIC Committee |
| TBA – to be assigned |
Authorized Ballots
* * * Cycle 3 for West 2008 Meeting * * * |
| Document # | Document Title | Task Force |
4133A | Revision to SEMI E47.1, Provisional Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm Wafers | 300mm Wafer Carriers / Conveyor Rail WG |
* * * Cycle 4 for West 2008 Meeting * * * |
| Document # | Document Title | Task Force |
4371A | Revision to SEMI E85, Specification for Physical AMHS Stocker to Interbay Transport System Interoperability | E85 Revision |
* * * Blue Ballots * * * |
| Document # | Document Title | Task Force |
4570
reissue | New Standard: 450mm In-Fab Carrier and Interface Standard | 450 mm IPIC |
TBA | New Standard: 450mm Load Port and Interface Standard | 450 mm IPIC |
* * * To be submitted for GCS Approval * * * |
| Document # | Document Title | Task Force |
4466A | New Standard: Mechanical Specification for a 150 mm EUVL Reticle SMIF Pod (Euv Pod) | EUV Reticle Handling |
TBA | Revision to SEMI E84, Specification for Enhanced Carrier Handoff Parallel I/O Interface | E84 Revision |
TBA | SEMI E1 rewrite (i.e., consolidation of SEMI E1 and its subdocuments into one standard). Revisions to:
* SEMI E1, Specification for 3 inch, 100 mm, 125 mm, and 150 mm Plastic and Metal Wafer Carriers
* SEMI E1.1, Standard for 3 inch Plastic and Metal Wafer Carriers, General Usage
* SEMI E1.2, Standard for 100 mm Plastic and Metal Wafer Carriers, General Usage
* SEMI E1.3, Standard for 125 mm Plastic and Metal Wafer Carriers, General Usage
* SEMI E1.4, Standard for 125 mm Plastic and Metal Wafer Carriers, Auto Transport Usage
* SEMI E1.5, Standard for 150 mm Plastic and Metal Wafer Carriers, General Usage
| Global PIC Maintenance |
TBA | Revision to SEMI E19.1, Port Standard for Mechanical Interface of Wafer Cassette Transfer, 100 mm (4 inch) Port | Global PIC Maintenance |
TBA | Revision to SEMI E19.2, Port Standard for Mechanical Interface of Wafer Cassette Transfer, 125 mm (5 inch) Port | Global PIC Maintenance |
TBA | Revision to SEMI E19.3, Port Standard for Mechanical Interface of Wafer Cassette Transfer, 150 mm (6 inch) Port | Global PIC Maintenance |
TBA | Revisions to SEMI E21, Cluster Tool Module Interface: Mechanical Interface and Wafer Transport Standard and SEMI E21.1, Cluster Tool Module Interface 300 mm: Mechanical Interface and Wafer Transport Standard | Global PIC Maintenance |
TBA | Revisions to SEMI E22, Cluster Tool Module Interface: Transport Module End Effector Exclusion Volume Standard and and SEMI E22.1, Cluster Tool Module Interface 300 mm: Transport Module End Effector Exclusion Volume Standard | Global PIC Maintenance |
TBA | Reapproval for SEMI E20, Cluster Tool Module Interface: Electrical Power and Emergency Off Standard | PIC Committee |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
SEMICON West 2008 Meeting Schedule [tentative]
San Francisco, California
July 13-17, 2008
San Francisco Marriott Hotel
55 Fourth Street
San Francisco, California 94103
http://www.marriott.com/hotels/travel/sfodt-san-francisco-marriott
Monday - July 14
* Int’l E84 Revision (8:00am to 10:00am)
* 300 mm Wafer Carriers TF (10:00am to 11:00am)
* E85 Revision TF (11:00am to 12:00noon)
* 450 mm IPIC TF (1:00pm to 6:00pm)
* TBD: EUV Reticle Handling TF (8:00am to 5:00pm)
* TBD: Int’l 300 mm Wafer Shipping Box TF (2 hours)
Tuesday - July 15
* Global PIC Maintenance TF (9:00am to 10:00am)
* 450 mm IPIC TF (8:00am to 5:00pm)
Wednesday - July 16
* PIC Committee (8:00am to 12:00noon)
Next Meeting
None.
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