SEMI
  HOME
SEMI International Standards
Standards Locale: Europe
Committee: Silicon Wafer
Place of Meeting: Munich, Germany
Date of Meeting: 11/16/2023
Meeting End Date: 11/16/2023
Recording SEMI Standards Staff: Kevin Nguyen
CER Posted to Web: 11/20/2023


Leadership Changes

WG/TF/SC/TC Name
Previous Leader
New Leader
Int'l Test Methods TFPeter Wagner (Self)Thomas Hager (Siltronic)
Int'l Terminology TFPeter Wagner (Self) (stepped down)TBD


Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
7162SNARFInt'l Test Methods TFNew Standard: Test Method for epi-resistivity determination in Si wafers by Surface Charge Profiling
7163SNARFInt'l AWG TFReapproval of SEMI MF1530-0707 (Reapproved 1018): Test Method for Measuring Flatness, Thickness, and Total Thickness Variation on Silicon Wafers by Automated Noncontact Scanning
.

Authorized Ballots

#
When
TF
Details
7024Cycle 9, 1 or 2, 3, 4-2024Int'l Polished Wafer TFLine Item Revision to SEMI M1-0918 Specification for Polished Single Crystal Silicon Wafers ( Diameter tolerance for 300 mm wafers)
7163Cycle 9, 1 or 2, 3, 4-2024Int'l AWG TFReapproval of SEMI MF1530-0707 (Reapproved 1018): Test Method for Measuring Flatness, Thickness, and Total Thickness Variation on Silicon Wafers by Automated Noncontact Scanning


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
November 15, 2024 in conjunction with SEMICON Europa. Check www.semi.org/standards for the latest update..











Copyright © 2008 Semiconductor Equipment and Materials International (SEMI®).
All rights reserved.