Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
| 5252A | Revision of SEMI M57-1011 with Title Change To: Specifications for Silicon Annealed Wafers | Passed with editorial changes |  5252A_Ballot Review Sheet_r1.pdf |
| 5442 | Reapproval of SEMI M74-1108, Specification for 450 mm Diameter Mechanical Handling Polished Wafers | Passed as balloted (Super clean) |  5442_Ballot Review Sheet(Reapproval).pdf |
| 5441 | Line Items Revision of SEMI M1-0812, Specifications for Polished Single Crystal Silicon Wafers | See below. |  5441_Ballot Review Sheet(LIs)_r2.pdf |
| Line Item 1 | This line item includes all changes in Section 2.6 of Table 1 (including addition of two new footnotes), in ¶¶ 6.6 through 6.6.3.4 including rearrangement of Tables 3 through 11, and in ¶ R4-7.5 as well as removal of Appendix 3 and addition of Related Information 2. | Passed |
| Line Item 2 | This line item includes only removal of § 7 | Passed as balloted (Super clean) |
| Line Item 3 | This line item includes all other changes in the document. (See ¶¶ 2.1, 3.1, R3-3.1, R4-7.6 (Note 1), R4-7.7 (including removal of Note 6), and Footnote 3; §§ A1-1, A2-1, A2-2, A3-1, R3-1, and R4-1.) | Passed as balloted (Super clean) |
| 5448 | Revision of SEMI MF1528-0308, Test Method for Measuring Boron Contamination in Heavily Doped N-Type Silicon Substrates by Secondary Ion Mass Spectrometry | Passed as balloted (Super clean) |  5448_Ballot Review Sheet_SuperClean.pdf |
| 5449 | Reapproval of SEMI MF1049-0308, Practice for Shallow Etch Pit Detection on Silicon Wafers | Passed as balloted (Super clean) |  5449_Ballot Review Sheet_SuperClean.pdf |
| 5451 | Reapproval of SEMI MF1366-0308, Test Method for Measuring Oxygen Concentration in Heavily Doped Silicon Substrates by Secondary Ion Mass Spectrometry | Passed as balloted (Super clean) |  5451_Ballot Review Sheet SuperClean.pdf |
| 5313B | Line Item Revisions of SEMI MF1535-0707, Test Method for Carrier Recombination Lifetime in Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance | See below. |  5313B_Ballot Review Sheet_LIs_r1.pdf |
| Line Item 1 | Changes to ¶1.3 | Failed |
| Line Item 2 | Renumbering of certain paragraphs and notes in §2 Scope, and correction to Note 1 | Failed |
| Line Item 3 | Addition of ¶3.8 and reference 7 | Failed |
| Line Item 4 | Corrections in ¶¶4.1, 5.1, 6.1.2, 6.1.3, 6.4, 7.2, 8.4, 11.3.2, and 13.1.6, Footnote 9, and the caption of Figure 3, and addition of reference 16 in §14 | Failed |
| Line Item 5 | Changes to Appendix 1 | Failed |
| Line Item 6 | Changes to Related Information 1 | Failed |
| Line Item 7 | Changes to Related Information 2 | Failed |
| Line Item 8 | Changes to Related Information 3 | Failed |
| 5389 | Revision to MF1982-1110, Test Method for Analyzing Organic Contaminants on Silicon Wafer Surfaces by Thermal Desorption Gas Chromatography | Failed and turned to the Task Force for rework. |  5389_Ballot Review Sheet_r2.pdf |
| 5424A | Line Items Revision to SEMI M62-0912, Specifications for Silicon Epitaxial Wafers | See below. |  5424A_Ballot Review Sheet_r2.pdf |
| Line Item 1 | Revision of Tables R2-7 & R2-8 - Change ¶3-1.7 | Passed as balloted (Super clean) |
| Line Item 2 | Revision of Tables R2-7 & R2-8 - Change ¶3-2.7 and explanation #9 | Failed and turned to the Task Force for rework. |
| 5450 | Revision to SEMI M49-0912, Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology Generations with Title Change to: Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 16 nm Technology Generations | Failed and turned to the Task Force for rework. |  5450_Ballot Review Sheet_r2.pdf |
# | Type | SC/TF/WG | Details |
| 5542 | SNARF | International Epitaxial Wafer Task Force | Line Items Revision to M62-0912, Specifications for Silicon Epitaxial Wafers |
| 5541 | SNARF | Internatinal SOI Task Force | Revision of SEMI M41-0707 Specification of Silicon-on-Insulator (SOI) for Power Device/ICs |
| 5540 | SNARF | International AWG Task Force | New Auxiliary Information, Illustration of Flatness and Shape Metrics for Silicon Wafers |
| 5539 | SNARF | International AWG Task Force | Revision of SEMI MF1390-0707 (Reapproved 0512) ,Test Method for Measuring Warp on Silicon Wafers by Automated Non-Contact Scanning |
| 5503 | Revised SNARF | International Advanced Surface Inspection Task Force | Line Items Revision to SEMI M52-0912 Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 11 nm Technology Generations (Re: To add M80 in reference)
Note, this is a revised SNARF approval. |
 | TFOF | Japan Test Method Task Force | |