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SEMI International Standards
Standards Locale: North America
Committee: MEMS / NEMS
Place of Meeting: SEMI Headquarters in San Jose, California
Date of Meeting: 10/24/2011
Meeting End Date: 10/24/2011
Recording SEMI Standards Staff: Paul Trio
CER Posted to Web: 11/03/2011
Leadership Changes

Group
Previous Leader
New Leader
MEMS Material Characterization TFKevin Turner (University of Wisconsin)Kevin Turner (University of Pennsylvania), change of affiliate
MEMS Reliability TFRavi Doraiswami (University of Maryland)Ravi Doraiswami, change of affiliate


TC Chapter Structure Changes
None.

Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.
Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
5117A
Revision of SEMI MS2-1109, Test Method for Step-Height Measurements of Thin FilmsPassed as balloted. Superclean5117AProcedureReview.doc
5118
Revision of SEMI MS4-1109, Test Method for Young’s Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in ResonancePassed as balloted. Superclean5118ProcedureReview.doc


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
TBD
SNARFNA MEMS/NEMS CommitteeReapproval of SEMI MS1-0307, Guide to Specifying Wafer-Wafer Bonding Alignment Targets
TBD
SNARFMicrofluidics TFRevision to SEMI MS7-0708 - Specification for Microfluidic Interfaces to Electronic Device Packages
[SNARF to be submitted at the NA Standards Spring 2012 Meeting (April 2)]
Note: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF

Authorized Ballots

#
When
SC/TF/WG
Details
5266 InfoNov-Dec 2011Packaging TFNew Standard: Guide for Determining Fluid Permeation through MEMS Packaging Materials
[Informational Ballot to be issued before Cycle 1, 2012]
5266C1-12Packaging TFNew Standard: Guide for Determining Fluid Permeation through MEMS Packaging Materials
TBDC1-12
(or C2-12)
MEMS/NEMS CommitteeReapproval of SEMI MS1-0307, Guide to Specifying Wafer-Wafer Bonding Alignment Targets
4719AC3-12
(or C4-12)
Terminology TFRevision to SEMI MS3-0307, Terminology for MEMS Technology
TBDC3-12
(C4-12)
Microfluidics TFRevision to SEMI MS7-0708 - Specification for Microfluidic Interfaces to Electronic Device Packages


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
North America Standards Spring 2012 Meetings
April 2-5, 2011
SEMI Headquarters
3081 Zanker Road
San Jose, California 95134
U.S.A.

Monday, April 2
- Wafer Bond TF (8:00 AM to 9:00 AM)
- Microfluidics TF/Microtube WG (9:00 AM to 10:00 AM)
- Packaging TF (10:00 AM to 11:00 AM)
- Terminology TF (11:00 AM to 11:30 AM)
- MEMS Reliability WG (11:30 AM to 12:00 Noon)
- Joint Materials Characterization TF and ASTM E08.05.03 Meeting (1:30 PM to 2:30 PM)
- MEMS / NEMS Committee (2:30 PM to 4:30 PM)









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