SEMI International Standards
| Standards Locale: Japan |
| Committee: 3D Packaging and Integration |
| Place of Meeting: SEMMI Japan office |
| Date of Meeting: 01/26/2024 |
| Meeting End Date: 01/26/2024 |
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| Recording SEMI Standards Staff: Mami Nakajo |
| CER Posted to Web: 02/02/2024 |
Leadership Changes
WG/TF/SC/TC Name | Previous Leader | New Leader |
| Wafer Bond Strength Measurement by Double-cantilever Beam TF | | Fumihiro Inoue ( YNU) ) |
| Wafer Bond Strength Measurement by Double-cantilever Beam TF | | Marie Sano (YNU) |
Committee Structure Changes
Previous WG/TF/SC Name | New WG/TF/SC Name or Status Change |
| Wafer Bond Strength Measurement by Double-cantilever Beam TF |
| Panel Level Packaging (PLP) Glass Carrier Task Force | Disband |
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
None.
Authorized Ballots
None.
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
Standard Designation | Title |
| SEMI G83-0619 | Specification for Bar Code Marking of Product Packages |
| SEMI G29-0519 | Test Method for Trace Contaminants in Molding Compounds |
| SEMI G55-0519 | Test Method for Measurement of Silver Plating Brightness |
| SEMI G43-0519 | Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages |
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
Thursday, May 23,2024,14:00-16:00 [JST] @OVTCCM
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