SEMI International Standards
Standards Locale: Japan
Committee: Assembly & Packaging
Place of Meeting: SEMI Japan, Tokyo, Japan
Date of Meeting: 03/25/2013
Meeting End Date: 03/25/2013
Recording SEMI Standards Staff: Naoko Tejima
CER Posted to Web: 03/28/2013
Leadership Changes
Group | Previous Leader | New Leader |
| Thin Chip (Die) Bending Strength Measurement Task Force | -- | Haruo Shimamoto
Morihiro Kada (ASET)
Shoji Yasunaga (Rohm)
Yuzo Shimobeppu (Fujitsu Semiconductor) |
TC Chapter Structure Changes
None.
Ballot Results
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
| 4965C | NEW STANDARD: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process | Passed as balloted |  4965C_Ballot_Report.pdf |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
-- | TFOF | Thin Chip (Die) Bending Strength Measurement Task Force | A new task force was chartered to develop standard(s) for Thin Chip (Die) Bending Strength Measurement. |
Authorized Ballots
None.
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
SEMI Japan Standards Summer 2013 Meetings
Friday, July 19, 2013, 15:00-17:00, SEMI Japan, Ichigaya, Tokyo, Japan
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