SEMI International Standards
Standards Locale: Japan
Committee: Physical Interfaces & Carriers
Place of Meeting: Otemachi PLACE HALL & CONFERENCE / OVTCCM (Hybrid)
Date of Meeting: 05/21/2026
Meeting End Date:
Recording SEMI Standards Staff: Takeaki Hirabara
CER Posted to Web: 06/05/2026
Leadership Changes
WG/TF/SC/TC Name | Previous Leader | New Leader |
Next Gen Assembly / Test Material
Handling Task Force | Stefan Radloff – Intel /
Shoji Komatsu – Acteon NEXT | Shoji Komatsu – Acteon NEXT |
TC Chapter Structure Changes
None.
Ballot Results
Document # | Document Title | TC Chapter Action | A&R Forms for Approved Ballots |
| 7454 | Line Item Revision to E100-1104 (Reapproved 0710): Specification for a Reticle SMIF Pod (RSP) Used to Transport and Store 6 Inch or 230 mm Reticles | Failed |  |
| PCR | Editorial Changes Type 2: E100-1104 (Reapproved 0710): Specification for a Reticle SMIF Pod (RSP) Used to Transport and Store 6 Inch or 230 mm Reticles | Passed |  A&R_PCR_E100_filled.pdf |
Ratification Ballot Results
Document # | Document Title | ISC A&R Action | A&R Forms |
| R7332 | New Standard: Specification for Large JEDECTM Tray Stack Load Port | Passed |  A&R_R7332.pdf |
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
Authorized Ballots
# | When | TF | Details |
| 7455 | Cycle 5, 2026 | Next Gen Assembly / Test Material
Handling Task Force | Line Item Revision to E182.3 - Specification for Panel FOUP load port with ground based delivery exclusion volume |
| 7454A | Cycle 5, 2026 | Global PIC Maintenance Task Force | Line Item Revision to E100-1104 (Reapproved 0710): Specification for a Reticle SMIF Pod (RSP) Used to Transport and Store 6 Inch or 230 mm Reticles |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
# | TF | Title |
| 7405 | 310mm Square Panel FOUP Task Force | New Standard: Specification for 310mm Square Panel FOUP |
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting of the Physical Interfaces & Carriers Global Technical Committee Japan TC Chapter is scheduled for September 11, 2026, 1:30pm – 4:30pm JST at SEMI Japan office and OVTCCM.
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