SEMI International Standards
Standards Locale: Japan
Committee: 3D Packaging and Integration
Place of Meeting: SEMI Japan/ OVTCCM
Date of Meeting: 03/09/2026
Meeting End Date: 03/09/2026
Recording SEMI Standards Staff: Akiko Yoshida
CER Posted to Web: 03/13/2026
Leadership Changes
WG/TF/SC/TC Name | Previous Leader | New Leader |
| 3D Packaging & Integration 5 Year Review TF | Masahiro Tsuriya (iNEMI) | N/A |
TC Chapter Structure Changes
Previous WG/TF/SC Name | New WG/TF/SC Name or Status Change |
| Steering Working Group | Disbanded |
| Wafer Bonding Pressure Evaluation TF | Wafer Surface Pressure Mapping by Pressure Measurement Film Task Force (TF name is changed) |
Ballot Results
Document # | Document Title | TC Chapter Action | A&R Forms for Approved Ballots |
| 7398 | New Standard: Test Method for Wafer Bond Strength Measurement by Double-Cantilever Beam | Passed with Editorial Changes |  7398_Ballot Review.pdf |
Note 1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Note 2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
Listing of all revised or new SNARF(s) approved by the Originating TC Chapter.
# | Type | SC/TF/WG | Details |
| 7460 | SNARF | 3D Packaging & Integration 5-Year Review TF | Line Item Revision to SEMI G82-1115, SPECIFICATION FOR 300 mm LOAD PORT FOR FRAME CASSETTES IN BACKEND PROCESS |
| 7461 | SNARF | 3D Packaging & Integration 5-Year Review TF | Line Item Revision to G95-1120, SPECIFICATION FOR MECHANICAL FEATURES OF 450 mm LOAD PORT FOR TAPE FRAME CASSETTES IN THE BACKEND PROCESS |
| 7462 | SNARF | 3D Packaging & Integration 5-Year Review TF | Line Item Revision to SEMI G74-0699 (Reapproved 1020), SPECIFICATION FOR TAPE FRAME FOR 300 mm WAFERS |
| 7463 | SNARF | 3D Packaging & Integration 5-Year Review TF | Line Item to SEMI G87-1108 (Reapproved 1020), SPECIFICATION FOR PLASTIC TAPE FRAME FOR 300 mm WAFER |
 | TFOF | Wafer Surface Pressure Mapping by Pressure Measurement Film TF | Revise TFOF to change the TF name
From: Wafer Bonding Pressure Evaluation Task Force
To: Wafer Surface Pressure Mapping by Pressure Measurement Film Task Force |
| 7464 | SNARF | Wafer Surface Pressure Mapping by Pressure Measurement Film TF | New Standard: Guide for Using Pressure Measurement Film for Wafer Surface Pressure Mapping in Equipment Alignment Processes |
Note 1: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF
Authorized Ballots
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.
# | When | TF | Details |
| 7460 | Cycle 4, 2026 | 3D Packaging & Integration 5-Year Review TF | Line Item Revision to SEMI G82-1115, SPECIFICATION FOR 300 mm LOAD PORT FOR FRAME CASSETTES IN BACKEND PROCESS |
| 7461 | Cycle 4, 2026 | 3D Packaging & Integration 5-Year Review TF | Line Item Revision to G95-1120, SPECIFICATION FOR MECHANICAL FEATURES OF 450 mm LOAD PORT FOR TAPE FRAME CASSETTES IN THE BACKEND PROCESS |
| 7462 | Cycle 5, 2026 | 3D Packaging & Integration 5-Year Review TF | Line Item Revision to SEMI G74-0699 (Reapproved 1020), SPECIFICATION FOR TAPE FRAME FOR 300 mm WAFERS |
| 7463 | Cycle 5, 2026 | 3D Packaging & Integration 5-Year Review TF | G87-1108 (Reapproved 1020), SPECIFICATION FOR PLASTIC TAPE FRAME FOR 300 mm WAFER |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting is scheduled for Friday, June 5, 2026 2:00 PM - 4:00 PM JST via OVTCCM and at SEMI Japan Office, Tokyo, Japan (Hybrid).
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