SEMI International Standards
Standards Locale: Japan
Committee: 3D Packaging and Integration
Place of Meeting: SEMI Japan, Toko, Japan/ OVTCCM
Date of Meeting: 06/05/2026
Meeting End Date: 06/05/2026
Recording SEMI Standards Staff: Akiko Yoshida
CER Posted to Web: 06/19/2026
Leadership Changes
WG/TF/SC/TC Name | Previous Leader | New Leader |
| 3D Packaging and Integration Japan TC Chapter | Kazunori Kato (AiT) | Noboru Hayasaka (AiT) |
| 310 mm Square Panel Glass Carrier TF | N/A
N/A | Mark Takahashi (Self)
Shoji Komatsu (Acteon NEXT) |
NOTE: The committee agreed to recommend a new leader for the 3D Packaging and Integration Japan TC Chapter for appointment by the JRSC, in accordance with Regulations § 5.7.5.
TC Chapter Structure Changes
Previous WG/TF/SC Name | New WG/TF/SC Name or Status Change |
| N/A | 310 mm Square Panel Glass Carrier TF |
Ballot Results
Document # | Document Title | TC Chapter Action | A&R Forms for Approved Ballots |
| 7460 | Line Item Revision to SEMI G82-1115 (Reapproved 1220), SPECIFICATION FOR 300 mm LOAD PORT FOR FRAME CASSETTES IN BACKEND PROCESS |  |  7460_Ballot Review.pdf |
| Line Item 1 | Modifications required for compliance with the Style Manual (all are under Line Item 1) | Passed as balloted | |
| 7461 | Line Item Revision to SEMI G95-1120, SPECIFICATION FOR MECHANICAL FEATURES OF 450 mm LOAD PORT FOR TAPE FRAME CASSETTES IN THE BACKEND PROCESS | |  7461_Ballot Review.pdf |
| Line Item 1 | Modifications required for compliance with the Style Manual (all are under Line Item 1) | Passed as balloted | |
Note 1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Note 2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
| TFOF | 310 mm Square Panel Glass Carrier TF | |
Authorized Ballots
# | Whe7 | TF | Details |
| 7464 | Cycle 7, 2026 or later | Wafer Surface Pressure Mapping by Pressure Measurement Film TF | New Standard: Guide for Using Pressure Measurement Film for Wafer Surface Pressure Mapping in Equipment Alignment Processes |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting is scheduled for Friday, September 25, 2026 2:00 PM - 4:00 PM JST via OVTCCM and at SEMI Japan Office, Tokyo, Japan (Hybrid).
|